3. from an analysis of the thickness of the layer of metal complex compounds with the DOE method showed that the quantity of chemical Ni, In and Ag do not result in a layer thickness of different soldering metal.
3. The analysis of the thickness of the metal compounds with the DOE found that the amount of elemental Ni, In and Ag did not result in a thick layer of solder different.
3. From the analysis of the thickness of the metal intermetallic compound method DOE found that the quantity of elements, and Ni In Ag don't result in different layer thickness of solder .