The effects of as-deposited (intrin

The effects of as-deposited (intrinsic) stress, externally applied (extrinsic) stresses, hardness, and modulus of various dielectric films on chemical-mechanical polishing (CMP) removal and post-CMP cleaning processes are studied in this article. Intrinsic stresses of the polished dielectrics do not contribute directly to the CMP removal rate. Extrinsic stresses including normal and shear components are calculated using principles of elasticity and fluid mechanics respectively and their roles in the material removal process are discussed. Theoretical evaluation and experimental results both suggest that hardness and modulus are the two most important material characteristics affecting the CMP process. Efficiency of post-CMP particle extraction can be monitored using an adhesion probability which is related to the hardness of wafer and pad. In addition, particle removal rate can be remarkably enhanced by increasing pressure (normal stress) while increasing pad rotation speed (shear stress) contributes little to reduce the particle count.

ผลลัพธ์ (แอฟริกา) 1:

Die gevolge van so-gedeponeer (intrinsieke) stres, ekstern toegedien (ekstrinsieke) beklemtoon, hardheid, en modulus van verskeie diëlektriese films op chemiese-meganiese poleer (CMP) verwydering en post-CMP skoonmaak prosesse word bestudeer in hierdie artikel. Intrinsieke spanning van die gepoleerde diëlektrika nie direk bydra tot die CMP verwydering koers. Ekstrinsieke spanning insluitende normale en skeer komponente bereken onderskeidelik deur beginsels van elastisiteit en vloeimeganika en hul rolle in die materiaal verwydering proses word bespreek. Teoretiese evaluering en eksperimentele resultate dui ook daardie hardheid en modulus is die twee belangrikste materiaal eienskappe wat die CMP proses. Doeltreffendheid van die post-CMP deeltjie onttrekking kan gemonitor word met behulp van 'n adhesie waarskynlikheid wat verband hou met die hardheid van wafer en pad. Daarbenewens kan deeltjie verwydering koers merkwaardig verbeter word deur toenemende druk (normale stres), terwyl die verhoging pad rotasie spoed (skuifspanning) dra min om die telling deeltjie te verminder.