Most common termination materials i

Most common termination materials include palladium-silver
alloy, silver, and gold. Solder finish applied over precious
metal electrodes shall have a diffusion-barrier layer between
the electrode metallization and the solder finish. The barrier
layer should be nickel or an equivalent diffusion barrier, and
should be at least 0.00125 mm [0.00005 in] thick.

ผลลัพธ์ (อังกฤษ) 2:

Most common termination Materials include Palladium-Silver
Alloy, Silver, and Gold. Applied over solder Finish Precious
Metal electrodes Shall have a Diffusion Barrier-layer between
the electrode and the solder Metallization Finish. The Barrier
layer or an Equivalent Diffusion Barrier Nickel should be, and
should be at Least 0.00125 mm [0.00005 in] Thick.