For the analysis to study the effects of changes of temperature stress that occurs in the Bi-metallic with analyses FEMAP Plate in order to calculate the temperature change of plates made out of different material types, that is, Solder, and Ge, which has a coefficient of expansion does not equal, connected together by 4 edge is Fixed from the analysis found that the high heat pad will occur in high stress causes a bend. That resulted in the adjacent sheet bend.
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