From New yield of type CXM3651XR lotC56V Test FC after the fail Test no. 7011,1011 we bring NG research found that the problem is caused by WB Process BNSOP by Bump ball stick pad , such as our disposition. were divided into 4 groups: group 1, which is the group that we have a problem with me, Match tray fail test showed that the most likely to be distributed in the tray at 40-45, we judge it to be the work tray X-. ray any problem BNSOP to Reject NG IC if the X-ray through the bringing into TC 10Cyc. Then, if the test passed, allowing the Group to the Group 2, the X-ray and roll if the TC Group 1 pass, they can. floatable
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